The Red Magic 10 Pro series will be launched at 15:00 on November 13th in Beijing, with the phone being called the "Screen Technology Breakthrough."

RedMagic 10 Pro

Renderings of the Red Magic 10 Pro series have surfaced online, showing the phone with extremely narrow bezels. This model will debut with 1.5K under-display camera technology, making it the highest resolution true full-screen phone to date.

For comparison, the Red Magic 9S Pro series, launched in early July this year, featured a 6.8-inch 2480*1116 resolution punch-hole-free full screen, closer to 1080P. The Red Magic 10 Pro series will upgrade to 1.5K.

It is reported that the screen is co-developed by Red Magic and BOE (BOE Technology Group), and it is worth noting that the new generation true full-screen, co-developed by Red Magic and BOE, will be delivered on November 5th in Chengdu.

To achieve the ultra-narrow bezels, the Red Magic 10 Pro series adopts the Super COP packaging process, and it also features the industry’s most advanced SIP ultra-narrow bezel technology. Additionally, the overall structural design of the Red Magic 10 Pro series challenges the limits once again. Through material replacement and process modification, the middle frame wall thickness has been reduced, increasing strength.

RedMagic 10 Pro

This time, Red Magic will launch three models: Red Magic 10 Pro, Red Magic 10 Pro+, and Red Magic 10 Ultra. The screen sizes of the first two models will be around 6.9 inches, while the Red Magic 10 Ultra will have a screen size exceeding 7 inches.

Moreover, the battery capacity of the Red Magic 10 Pro series exceeds 7000mAh, making it the phone with the largest battery among Snapdragon 8 Gen 2 models to date.

To unleash the powerful performance of Snapdragon 8 Gen 2, the Red Magic 10 Pro series brings PC-level cooling technology perfectly to mobile devices, addressing packaging challenges and achieving a groundbreaking breakthrough in mobile heat dissipation technology.